VACUUM DEPOSITION SYSTEMS
The range of custom semiconductor equipment products manufactured by AIT are of the best functional design made with the highest quality of materials and components for long-term reliability. The equipment is available in a wide variety of configurations with different options to ensure it will meet all processing requirements. AIT’s extensive experience in the design, fabrication and use of the semiconductor equipment products it manufactures guarantees complete customer satisfaction.
PVD SPUTTERING SYSTEM
The AIT PVD Sputter Systems are custom-designed for R&D Laboratory, Pilot Production and full Production applications.Key performance features include the uniform deposition of a wide variety of materials on various different substrates.Additional features include versatility, ease of operation, and long-term reliability for single and multi-layered films.
E-BEAM DEPOSITION SYSTEM
The AIT Electron Beam (E-Beam) Deposition Systems are custom designed for the deposition of single and multi-layered films.They are capable of sequential deposition of a wide variety of metals and dielectric films.The robust, reliable, production-proven E-beam systems are customized to optimize deposition rate, yield, throughput, and overall device performance.
PULSED LASER DEPOSITION SYSTEM
AIT’s Pulsed Laser Deposition (PLD) is specifically designed for R&D Laboratory and Pilot Production applications. Key performance features include the uniform deposition of a thin films including metals, dielectrics, complex alloys, oxides, nitrides, and ceramics on a variety of substrate materials.
ICP/RIE & DRIE
AIT’s DRIE, ICP/RIE is designed for dry etching solutions of a wide variety of dielectrics and semiconductor materials. The system uses an Inductively Coupled Plasma (ICP) source to generate a high-density plasma with a separate RF power supply to independently bias the substrate for controlling the ion energy. Reproducible and uniform thermal control is achieved with active cooling/heating using mechanical clamping, (liquid helium) backside cooling, and a recirculating fluid electrode.
System custom designed for high aspect ratio etching with smooth etched sidewall profile control, high yield and throughput.
PLASMA-ENHANCED CHEMICAL VAPOUR DEPOSITION SYSTEMS
The AIT PECVD System is designed for the RF deposition of SiOx, SiNx and SiOxNy in the manufacture of ICs, MMICs, LEDs, LDs, VCSELs, waveguides and MEMS devices on Si and GaAs substrates. Optimized uniform gas laminar flow stream provided by specially designed shower head and pumping channels for a robust, reliable, production-proven system to control and optimize the deposition rate, refractive index, film stress control, elimination of pin holes, increased yield and throughput, and overall device performance.
ION-BEAM DEPOSITON, ION-BEAM ETCHING & ION ASSISTED DEPOSITION
The AIT Ion Beam Deposition (IBD) and Ion Beam Etch (IBE) Systems are custom designed and configured respectively for ion beam deposition and ion beam etching in a variety of system sizes for R&D and production applications. Additional ion sources can be incorporated into the IBD System to pre-clean the substrate and Ion Assisted Deposition (IAD) for producing hard, high-packing density thin films for a wide variety of optical and electronic device applications.