The AIT Thermal Evaporation Deposition Systems are designed for the deposition of single and multi-layered thin and thick metal and dielectric films.

  • UHV vacuum deposition chambers configurable with various rotary vane, dry pumps and high-vacuum turbopumps and cryopumps.

  • Thermal resistance deposition sources in a variety of boat volumes and coated materials.

  • High-current, low voltage switchable power supply.

  • Selection of substrate holders including planar water-cooled (for lift-off applications), rotatable (0~30 rpm) and single rotating/revolving carousel.

  • Coating non-uniformity of <+/-5% WIW, WTF, and RTR.

  • Option for Ion Beam Etch (IBE) clean and Ion Assisted Deposition (IAD).

  • Option for substrate heating to maximum 350°C.

  • Quartz Crystal process controller/rate/layer thickness monitor (single/dual head).

  • PLC/PID Control/Operation for manual, semi-auto and fully-auto with auto process sequence generation/editing, multi-steps coating and storage of recipes.

  • Available as a mini thermal evaporation system for R&D applications.


Tel: (852) 2719-5440

Fax: (852) 2358-4766

1901 Sunley Center, 9 Wing Yin Street, Tsuen Wan, Hong Kong

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