AIT Receives Funding for its Lead-Free Technologies for Environmental Protection

Environmental pollution is a growing problem. Both governments and entrepreneurs are currently tackling various issues relating to pollution of the environment. It is predicted that the industry for environmental protection will gain prominence in the future. A ban on the use of lead-containing solders in electronic products is currently under consideration by various countries in order to help protect the environment. One such project that is funded by the Hong Kong Government1s Industry Department is with Advanced Interconnect Technology (AIT) Ltd. to develop six different types of lead-free bumps and to help the company to qualify and evaluate their suitability for commercial wafer bumping and flip-chip electronic packaging applications.

During a recent interview with Apple Daily, Dr. Karim, Technical Director of AIT, said that a worldwide ban on the use of lead-containing solders in electronic products is being consideration since the lead from such products has the potential to pollute the drinking water system when they are disposed of in landfills. The European Community already has plans to ban the production and use of electronic products containing lead starting January 2004. Similar legislation is pending in both the United States and Japan. In Dr. Karim1s estimation even though Japan has not yet passed a formal restrictive law to ban the use of lead, over half of their manufactured electronic products will be lead-free by as early as 2002. A total ban on lead will probably follow sometime in 2004.

Dr. Karim points out that electronic manufacturers around the world are currently putting a lot of effort to help identify suitable lead-free finishes for electronic components like printed circuit boards, lead-frame packages, and the selection of suitable solder paste materials. However, so far they have not paid much attention to the fabrication of lead-free bump interconnections which are required when packaging ICs by flip-chip bonding.

Received HK$2 Million in Funding from Industry Department

Dr. Karim said that their company currently provides gold, solder (eutectic and high-lead), copper, electroless nickel, and indium bumps for various flip-chip electronic package applications.

Dr. Karim said that their company was founded in 1995 to provide wafer bumping and flip-chip services to the semiconductor manufacturers and electronic packaging companies worldwide. Their major customers include Samsung and Motorola while their competitors are mainly Taiwanese companies.

Dr. Karim mentioned that their company has received a matching grant for HK$2 million from the Industry Department. They have already received the first phase of the funding of HK$400,000. After successful completion of the first phase they will receive the second phase of the funding for HK$1.6 million.