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June 2000 Hong Kong Apple Daily AIT Receives Funding for its Lead-Free Technologies for Environmental Protection (Translated) |
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| 29
June 2000 Hong Kong Apple Daily AIT Receives Funding for its Lead-Free Technologies for Environmental Protection (Original press in Chinese) |
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| 17
July 2000 Hong Kong Economic Times Lead-Free Electronic Products are Attractive for Hong Kong Industry (Translated) |
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| 17
July 2000 Hong Kong Economic Times Lead-Free Electronic Products are Attractive for Hong Kong Industry (Original press in Chinese) |
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Z. Karim and R. Schetty, "Lead-Free Bump Interconnections for Flip-Chip Electronic Packaging Applications", PackCon 2000, IEMT Conference, 3 October 2000, Santa Clara, CA, (2000). |
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Z. Karim and J. Martin, "Lead-Free Bump Interconnections for Flip-Chip Electronic Packaging Applications", SMTA Boston, 13 June 2001, Boston, MA, (2001). |
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Z.
Karim and J. Martin, "Lead-Free Bump Interconnections for |
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