1.GOLD BUMPS:
For Chip-On-Glass (COG), Tape-Automated-Bonding (TAB), and Chip-On-Flex (COF) applications. Minimum gold bump size of 10 mm x 10 mm with a maximum height of 25 mm. Typical bump hardness 45-60 Hv



Gold Bumps

2.INDIUM BUMPS:
For X-ray and Infra-Red (IR) detector applications. Single die bumping for HgCdTe, InSb, and CdZnTe. Minimum indium bump size of 10 mm diameter with a maximum height of 12 mm. Minimum separation between bumps of 8 mm.



Indium Bumps

3.COPPER BUMPS:
For COG and as a Under-Bump-Metal (UBM) for Pb/Sn solder bumps. Minimum copper bump size of 10 mm x 10
mm with a maximum height of 25 mm.
Minimum separation between bumps of 10 mm.

 

4.LEAD/TIN SOLDER BUMPS:
For Chip-On-Board (COB), Flip-Chip-In-Package (FCIP) and Chip-On-Flex (COF) applications. Minimum post-reflow lead/tin solder bump size of 15 mm diameter. Minimum separation between bumps of 20 mm.

a) EUTECTIC Lead-Tin (37/63)
Melting point of 187
ºC

b) HIGH-LEAD (95/5 and 90/10)
Melting point of 310
ºC



Lead-Tin Bumps

5.ELECTROLESS NICKEL BUMPS:
As a low-cost UBM for screen-printing of solder bumps.


Electroless Nickel Bumps

 

6.PURE TIN-BUMPS:
Melting point of 232 ºC


Before Reflow

After Reflow
7.LEAD-FREE TIN-BISMUTH BUMPS:
Composition of 80/20 Sn/Bi with a melting point of 185 ºC.

Before Reflow

After Reflow
8.LEAD-FREE TIN-COPPER BUMPS:
Composition of 99/1 Sn/Cu with a melting point of 227 ºC.

Before Reflow


After Reflow