Specialized Bumping of:
Single die (indium and electroless nickel only) for Si, GaAs, HgCdTe, InSb, and CdZnTe
Thinned Wafers
Probed Wafers
Two-sided Polished Wafers
GaAs Wafers
8 x 8 array indium bumped daisy-chain test die
   

Rapid Prototyping bump fabrication service for evaluation of various different bump media and flip-chip assembly processes

 
   

Custom Test Parts consisting of Daisy-Chains
for evaluation of:
Bump interconnections
Flip-chip bonding processes
Flip chip bonding equipment
Low & high temerature storage
Accelerated aging
Thermal cycling

Through substrate IR micrograph of an indium-bumped and bonded test die
   

Daisy-Chain test patterns are available on various substrates including Si and GaAs wafers, glass substrates, ITO-etched glass, flex substrates, and printed circuit boards

 

  
   
Integrated Passive Devices (IPD) - Custom made IPD's made from electroplated Cu, Ni and Au are available on a variety of substrates including Si, GaAs, glass and ceramics
  Plated inductor coil for flip-chip bonding
 

Additional Services Include:
Custom Photomask Layouts (in GDSII or CIF formats)
Photomask Fabrication (5", 7" and 9")
I/O Pad Re-Distribution with BCB
Wafer Dicing
Through Substrate Infrared (IR) Scans
X-ray Imaging
Flip-Chip-on-Glass Bonding
Flip-Chip-on-Board Bonding

 
Through glass micrograph of a flip-chip-on-glass Au-bumped and flip-chip bonded LCD drive IC