ADVANCED INTERCONNECT TECHNOLOGY LIMITED
	was founded in 1995 to provide a Custom Wafer Bumping service to the semiconductor wafer fabrication and chip packaging houses.
	Production facilities currently consist of a Class 1000 cleanroom with Class 100 areas for Au, In, Cu, Pb/Sn (eutectic and high-lead), electroless Ni, and Pb-free (pure-Sn, Sn:Bi, Sn:Cu Sn:Ag, and Sn:Ag:Cu) bumping. Bumping services are available on 2", 3", 4", 5", 6"and 8" wafers with single die bumping with In and electroless Ni only.
	AIT also provides technology licencing, rapid prototyping, and a consultancy service for flip-chip-on-glass (FCOG), flip-chip-on-board (FCOB), and flip-chip-in-package (FCIP) technologies.
	Additional services include custom photomask layouts, photomask fabrication, daisy-chain test die and substrates, I/O pad redistribution, wafer dicing, IR and SEM scans.